National cooperative research notifications: Universal Instruments Corp.,

[Federal Register: September 29, 1998 (Volume 63, Number 188)]

[Notices]

[Page 51957-51958]

From the Federal Register Online via GPO Access [wais.access.gpo.gov]

[DOCID:fr29se98-145]

DEPARTMENT OF JUSTICE

Antitrust Division

Notice Pursuant to the National Cooperative Research and Production Act of 1993--Universal Instruments Corporation (``Universal'')

Notice is hereby given that, on March 20, 1998, pursuant to Section 6(a) of the National Cooperative Research and Production Act of 1993, 15 U.S.C. 4301 et seq. (``the Act''), Universal Instruments Corporation (``Universal'') has filedwritten notifications simultaneously with the Attorney General and the Federal Trade Commission disclosing (1) the identities of the parties and (2) the nature and objectives of the venture. The notifications were filedfor the purpose of invoking the Act's provisions limiting the recovery of antitrust plaintiffs to actual damages under specified circumstances. Pursuant to Section 6(b) of the Act, the identities of the parties are Universal Instruments Corporation, Binghamton, NY; Allen-Bradley Co., Inc., Mayfield Hts., OH; AMKOR Electronics Inc., Chandler, AZ; Cabletron Systems Inc., Rochester, NY; Flip Chip Technologies, Phoenix, AZ; Digital Equipment Corporation, Hudson, MA; Eastman Kodak Company, Rochester, NY; ERICSSON RADIO SYSTEMS AB, Stockholm, SWEDEN; Heller Industries, Florham Park, NJ; IBM Corporation, Endicott, NY; Kester

[[Page 51958]]

Solder Div., Litton Systems, Inc., DesPlaines, IL; LSI Logic, Milpitas, CA; Nokia Mobile Phones, Ltd., Salo, FINLAND; Philips Consumer Communications, LeMans, FRANCE; Photo Stencil, Colorado Springs, CO; Robert Bosch GmbH, Stuttgart, GERMANY; VLSI Corporation, San Jose, CA; SGS-Thomson Microelectronics, Inc., Carrollton, TX; and Plexus Corporation, Neenah, WI. The nature and objectives of the venture are to acquire an in-depth understanding of all the material interactions and process limitations affecting Chip Size Packaging (``CSP'') and Direct Chip Attach (``DCA'') technologies which can be used to produce high quality products at high yields in the electronics industry. The overall objective of the venture is to provide fully documented processes which can be used to produce high quality product at high yields. Constance K. Robinson, Director of Operations Antitrust Division.

[FR Doc. 98-26049Filed9-28-98; 8:45 am]

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