Mandatory Greenhouse Gas Reporting
Federal Register, Volume 80 Issue 48 (Thursday, March 12, 2015)
Federal Register Volume 80, Number 48 (Thursday, March 12, 2015)
Rules and Regulations
Pages 12934-12935
From the Federal Register Online via the Government Printing Office www.gpo.gov
FR Doc No: 2015-05549
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ENVIRONMENTAL PROTECTION AGENCY
40 CFR Part 98
Mandatory Greenhouse Gas Reporting
CFR Correction
In Title 40 of the Code of Federal Regulations, Parts 96 to 99, revised as of July 1, 2014, on pages 696 through 698, in subpart I of part 98, tables I-5 through I-7 are corrected to read as follows:
Table I-5 To Subpart I of Part 98--Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS
Manufacturing
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Process gas i
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Process type factors NF3
CF4 C2F6 CHF3 CH2F2 C3F8 c- C4F8 Remote NF3 SF6 C4F6a C5F8a C4F8Oa
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Etch 1-Ui................................... 0.7 10.4 10.4 10.06 NA 10.2 NA 0.2 0.2 0.1 0.2 NA
Etch BCF4................................... NA 10.4 10.07 10.08 NA 0.2 NA NA NA 10.3 0.2 NA
Etch BC2F6.................................. NA NA NA NA NA 0.2 NA NA NA 10.2 0.2 NA
CVD Chamber Cleaning 1-Ui................... 0.9 0.6 NA NA 0.4 0.1 0.02 0.2 NA NA 0.1 0.1
CVD Chamber Cleaning BCF4................... NA 0.1 NA NA 0.1 0.1 20.02 20.1 NA NA 0.1 0.1
CVD Chamber Cleaning BC3F8.................. NA NA NA NA NA NA NA NA NA NA NA 0.4
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Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a
particular gas is not used in or emitted from a particular process sub-type or process type.
\1\ Estimate includes multi-gas etch processes.
\2\ Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive.
Table I-6 To Subpart I of Part 98--Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-
Product Formation Rates (Bijk) for LCD Manufacturing
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Process gas i
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Process type factors NF3
CF4 C2F6 CHF3 CH2F2 C3F8 c- C4F8 Remote NF3 SF6
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Etch 1-Ui...................... 0.6 NA 0.2 NA NA 0.1 NA NA 0.3
Etch BCF4...................... NA NA 0.07 NA NA 0.009 NA NA NA
Etch BCHF3..................... NA NA NA NA NA 0.02 NA NA NA
Etch BC2F4..................... NA NA 0.05 NA NA NA NA NA NA
CVD Chamber Cleaning 1-Ui...... NA NA NA NA NA NA 0.03 0.3 0.9
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Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas.
This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-
type or process type.
Table I-7 To Subpart I of Part 98--Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-
Product Formation Rates (Bijk) for PV Manufacturing
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Process gas i
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Process type factors NF3
CF4 C2F6 CHF3 CH2F2 C3F8 c- C4F8 Remote NF3 SF6
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Etch 1-Ui...................... 0.7 0.4 0.4 NA NA 0.2 NA NA 0.4
Etch BCF4...................... NA 0.2 NA NA NA 0.1 NA NA NA
Etch BC2F6..................... NA NA NA NA NA 0.1 NA NA NA
CVD Chamber Cleaning 1-Ui...... NA 0.6 NA NA 0.1 0.1 NA 0.3 0.4
Page 12935
CVD Chamber Cleaning BCF4...... NA 0.2 NA NA 0.2 0.1 NA NA NA
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Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas.
This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-
type or process type.
FR Doc. 2015-05549 Filed 3-11-15; 8:45 am
BILLING CODE 1505-01-D
